Mission:

The Electro-Optics Lab was established in 1431 H (2010) with an aim to engage in design, manufacturing and testing infrared and electro-optical sensors, focal plane arrays and camera systems. The lab also aims to educate a new generation of engineers, in the above named technologies who will be the driving force for technological advancement and innovation in the Kingdom of Saudi Arabia.

Description:

Focus Areas:

In the Electro-Optics Laboratory we perform in-house design, simulation, fabrication, and characterization for our devices and systems.

The research and development activities of Electro-Optics lab are currently focused in the following areas:

1. Microbolometers for infrared and millimeter wave detection.
2. Infrared and millimeter wave antennas.
3. Infrared and millimeter wave sensor materials.
4. Metal-insulator metal diodes.
5. Infrared and electro-optical imager testing.

Facilities and Equipments:

Our facilities include:

• Simulation software
  • COVENTOR for MEMS simulation.
  • HFSS for antenna simulation.
• Electronics
  • Agilent 35670A signal analyzer (122 µHz - 102.4 kHz).
  • Ametek 5210 lock-in amplifier.
  • An assortment of electronic lab equipment (DC power supplies, function generators, DMM, etc.).
  • Custom-built electronics: We build in-house custom low noise circuits for sensor bias and readout.
• Semiconductor Characterization
  • Agilent B1500 semiconductor parameter analyzer with I-V and C-V measurement capabilities.
  • Cascade Microtec EP6 DC parametric probe station. 
  • Vecco Dektak 150 surface profilometer for thin film profile measurements. 
  • JANDEL multiHeight four point probe.
  • Sentech infrared spectroscopic ellipsometer.
• Micro/nano Fabrication
  • A 22 m^2 softwall clean 1000 cleanroom.
  • Zeiss Scanning electron microscope (SEM) with Raith Elphy Quantum nanolithography module for electron-beam lithography.
  • NXQ 4004 contact mask aligner for photolithography.
  • AJA International magnetron sputtering system for deposition of thin metallic and non-metallic films.
  • Diener Electronics reactive ion etcher and plasma asher.   
  • FELCON fume hood with BOE etch bath.
  • Olympus MX51 semiconductor inspection microscope.
  • Hybond ultrasonic Wire Bonder.
  • ATV RV129 manual wafer scriber.
  • Brewer Science CEE 200 spin coater.
  • Brewer Science C1300 hot plate.